Home›Products›X-ray/ axi›European & american

Products Categories

Nordson DAGE XD7800 X-Ray Inspection System | Used Micro-focus X-Ray & 3D CT Equipment

Nordson DAGE XD7800 is equipped with world-class ultra-fine micro-focus X-ray source and high-sensitivity Flat Panel Detector, achieving outstanding magnification and sharp imaging for micro solder bump inspection.
Powerful analysis software supports automatic void calculation, precise dimensional measurement and defect reporting. The stable multi-axis motorized stage enables flexible sample positioning for small advanced packaging samples.
It is the upgraded model of XD7500NT, favored for semiconductor packaging and high-end failure analysis work.


#NordsonDAGEXD7800 #DAGEXRayInspection #SMTXRayInspection #PCBAXRayInspection #BGAXRayInspection #UsedDAGEXD7800 #MicroFocusXRay #3DCTXray
InquireAdd to Basket

Product DetailsFAQInquire

Nordson DAGE XD7800 X-Ray Inspection System | Used Micro-focus X-Ray & 3D CT Equipment



Nordson DAGE XD7800 is a premium offline micro-focus X-Ray inspection platform from Nordson DAGE, designed for advanced SMT, PCBA and semiconductor packaging failure analysis. It delivers ultra-high resolution imaging for micro solder bumps and tiny internal defects, with optional 3D CT reconstruction capability. This system is widely used for BGA, CSP, Flip Chip, WLCSP and power component quality validation and failure analysis in high-reliability electronics laboratories.


Key Inspection Capabilities

  • 2D Ultra-High Resolution Micro-focus X-Ray Inspection
  • Optional 3D CT Reconstruction
  • BGA / CSP / Flip Chip / WLCSP Solder Joint Inspection
  • Solder Void Detection & Quantitative Measurement
  • Insufficient / Excessive Solder Detection
  • Solder Bridging & Short Circuit Detection
  • Non-Wetting & Head-in-Pillow (HIP) Defect Detection
  • Crack & Delamination Detection
  • Hidden Solder Joint Inspection
  • Multi-layer PCB Internal Structure Inspection
  • Component Displacement Inspection


Core System Features

Nordson DAGE XD7800 is equipped with world-class ultra-fine micro-focus X-ray source and high-sensitivity Flat Panel Detector, achieving outstanding magnification and sharp imaging for micro solder bump inspection. Powerful analysis software supports automatic void calculation, precise dimensional measurement and defect reporting. The stable multi-axis motorized stage enables flexible sample positioning for small advanced packaging samples. It is the upgraded model of XD7500NT, favored for semiconductor packaging and high-end failure analysis work.


Typical Applications

SMT / PCBA, BGA / CSP / Flip Chip / WLCSP, Automotive Electronics, Power Electronics, Semiconductor Packaging, LED, Consumer Electronics, Industrial Electronics, Medical Electronics, High-Reliability Electronics


Typical Defects

Voids, Insufficient Solder, Excessive Solder, Solder Bridging, Open Solder Joints, Non-Wetting, Head-in-Pillow (HIP), Cracks, Delamination, Component Displacement, Damaged Components, Micro solder bump defects


Used Nordson DAGE XD7800

SMT Inspection World provides pre-owned Nordson DAGE XD7800 X-Ray inspection equipment for electronics manufacturers worldwide. All used machines will be professionally inspected, functionally tested and fully evaluated according to actual configuration and condition before delivery. We also provide installation, commissioning, maintenance, spare parts and technical support.


Equipment Services

Used Equipment Sales, Equipment Rental, Installation & Commissioning, Equipment Maintenance, Spare Parts Supply, Equipment Upgrade, Technical Support





Specializing in brand new & used PARMI 3D Automatic Optical Inspection (AOI) and 3D Solder Paste Inspection (SPI) equipment sales, rental and genuine spare parts supply. With more than ten years of in-depth industry experience, we have served over 50 manufacturing enterprises at home and overseas.

All new and used devices are fully overhauled, precision-calibrated and functionally tested in strict accordance with original factory delivery standards. Every hardware component, software program and optical system is debugged item by item to ensure excellent operating stability and inspection accuracy. All equipment is fully production-ready and can be put into SMT line operation immediately after arrival.

We support flexible procurement methods including direct equipment purchase, short-term and medium-long-term rental solutions. Perfectly adapting to order volume fluctuations, new project sampling, production line expansion and temporary equipment replacement, effectively reducing customers’ fixed asset investment pressure.
We provide one-stop professional services covering equipment installation, commissioning, on-site technical training, rapid fault response and regular maintenance. Reliable technical support and after-sales services are available for both domestic and overseas projects, ensuring long-term stable quality control of SMT production lines.


Scope of Services
✅ Brand new & full-range used PARMI 3D AOI equipment sales & rental
✅ Brand new & full-range used PARMI 3D SPI solder paste inspection equipment sales & rental
✅ Original spare parts supply for PARMI 3D AOI & 3D SPI
✅ Equipment precision calibration, complete machine overhaul and technical debugging
✅ Professional technical docking and after-sales support for global projects 

Inquire

Related Products

5