3D AOI (3D Automated Optical Inspection) is mainly used to automatically inspect PCB assemblies after component placement and soldering. It uses 3D optical technology to detect component placement errors, missing or incorrect components, polarity errors, soldering defects, and height-related abnormalities.

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3D SPI (3D Solder Paste Inspection) is mainly used after solder paste printing to inspect the quality of solder paste deposits before component placement. It measures solder paste volume, height, area, and position to identify printing defects at an early stage.

AXI (Automated X-Ray Inspection) is used to detect hidden defects that cannot be identified by optical inspection. It is particularly important for high-density PCB assemblies and components such as BGA, QFN and CSP.

ICT (In-Circuit Test) is mainly used to test the electrical characteristics and connectivity of a PCBA after assembly. It checks components, circuits, connections, and potential electrical defects to help identify problems before the product moves to the next production stage.

We provide new and used SMT inspection equipment, as well as spare parts, maintenance, repair, and technical support.
From equipment sourcing to after-sales service, we offer flexible and reliable solutions to help customers reduce costs, extend equipment life, and maintain stable production.