The MIRTEC MS-11 is a high-performance 3D Solder Paste Inspection (SPI) system suitable for versatile modern SMT production lines.
Adopting MIRTEC patented shadow-free dual-projection Moiré phase-shift 3D optical inspection technology, the equipment conducts comprehensive 3D analysis of solder paste printing quality, including solder paste height, volume, area, position, shape and printing consistency. It enables precise inspection for tiny 0201 pads and supports a minimum stencil thickness of 30μm.
By identifying printing defects at the early stage of the SMT process, the MS-11 helps manufacturers reduce downstream defects, improve process stability and raise the overall PCBA production yield.
#MIRTEC MS-11 #MIRTEC MS-11DL #MIRTEC MS-11e #MIRTEC 3D SPI #MS-11 SPI #3D Solder Paste Inspection #SMT SPI Machine #Solder Paste Inspection Equipment #MIRTEC SMT Inspection #High-Precision SPI
The MIRTEC MS-11 is a high-performance 3D Solder Paste Inspection (SPI) system suitable for versatile modern SMT production lines.
Adopting MIRTEC patented shadow-free dual-projection Moiré phase-shift 3D optical inspection technology, the equipment conducts comprehensive 3D analysis of solder paste printing quality, including solder paste height, volume, area, position, shape and printing consistency. It enables precise inspection for tiny 0201 pads and supports a minimum stencil thickness of 30μm.
By identifying printing defects at the early stage of the SMT process, the MS-11 helps manufacturers reduce downstream defects, improve process stability and raise the overall PCBA production yield.
#MIRTEC MS-11 #MIRTEC MS-11DL #MIRTEC MS-11e #MIRTEC 3D SPI #MS-11 SPI #3D Solder Paste Inspection #SMT SPI Machine #Solder Paste Inspection Equipment #MIRTEC SMT Inspection #High-Precision SPI
The Koh Young 8030-3 is a high-performance 3D Solder Paste Inspection (SPI) system designed for modern SMT production lines.
Using advanced 3D optical inspection technology, the 8030-3 provides comprehensive three-dimensional analysis of solder paste printing quality, including solder paste height, volume, area, position, shape, and printing consistency.
By detecting printing defects at an early stage of the SMT process, the 8030-3 helps manufacturers reduce downstream defects, improve process stability, and increase overall PCBA production yield.
#KohYoung KY8030-2 #KohYoung KY8030-3 #KohYoung KY8080 #KohYoung 3D SPI #3D Solder Paste Inspection #SMT SPI Machine #Solder Paste Inspection Equipment #KohYoung SMT Inspection #High-Precision SPI
The Koh Young 8030-3 is a high-performance 3D Solder Paste Inspection (SPI) system designed for modern SMT production lines.
Using advanced 3D optical inspection technology, the 8030-3 provides comprehensive three-dimensional analysis of solder paste printing quality, including solder paste height, volume, area, position, shape, and printing consistency.
By detecting printing defects at an early stage of the SMT process, the 8030-3 helps manufacturers reduce downstream defects, improve process stability, and increase overall PCBA production yield.
#KohYoung KY8030-2 #KohYoung KY8030-3 #KohYoung KY8080 #KohYoung 3D SPI #3D Solder Paste Inspection #SMT SPI Machine #Solder Paste Inspection Equipment #KohYoung SMT Inspection #High-Precision SPI
The Koh Young 8030-3 is a high-performance 3D Solder Paste Inspection (SPI) system designed for modern SMT production lines.
Using advanced 3D optical inspection technology, the 8030-3 provides comprehensive three-dimensional analysis of solder paste printing quality, including solder paste height, volume, area, position, shape, and printing consistency.
By detecting printing defects at an early stage of the SMT process, the 8030-3 helps manufacturers reduce downstream defects, improve process stability, and increase overall PCBA production yield.
#KohYoung KY8030-2 #KohYoung KY8030-3 #KohYoung KY8080 #KohYoung 3D SPI #3D Solder Paste Inspection #SMT SPI Machine #Solder Paste Inspection Equipment #KohYoung SMT Inspection #High-Precision SPI
The Koh Young 8030-3 is a high-performance 3D Solder Paste Inspection (SPI) system designed for modern SMT production lines.
Using advanced 3D optical inspection technology, the 8030-3 provides comprehensive three-dimensional analysis of solder paste printing quality, including solder paste height, volume, area, position, shape, and printing consistency.
By detecting printing defects at an early stage of the SMT process, the 8030-3 helps manufacturers reduce downstream defects, improve process stability, and increase overall PCBA production yield.
#KohYoung KY8030-2 #KohYoung KY8030-3 #KohYoung KY8080 #KohYoung 3D SPI #3D Solder Paste Inspection #SMT SPI Machine #Solder Paste Inspection Equipment #KohYoung SMT Inspection #High-Precision SPI
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