Nordson SE-3000 3D SPI
The Nordson SE-3000 is a high-performance 3D Solder Paste Inspection (SPI) system built for demanding modern SMT production lines.
Adopting Nordson patented Multi-Reflection Suppression (MRS®) sensor technology, the SE-3000 eliminates reflective interference from shiny solder paste and PCB surfaces, delivering metrology-grade 3D analysis of solder paste printing quality, including solder paste height, volume, area, position, shape, and printing consistency. It supports high-precision measurement for ultra-fine pitch components.
By detecting printing defects at an early stage of the SMT process, the SE-3000 helps manufacturers reduce downstream defects, improve process stability, and increase overall PCBA production yield.
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