GE phoenix|x-ray v|tome|x m is a high-performance industrial X-Ray Computed Tomography (CT) system designed for high-resolution 3D inspection, internal structure analysis and dimensional measurement.
The system combines high-power microfocus X-Ray technology with advanced 3D CT imaging, enabling manufacturers and engineers to inspect complex internal structures without destroying the sample. It is suitable for industrial inspection, electronics, semiconductor packaging, automotive components and advanced material analysis.
#GE phoenix v|tome|x m #GE v|tome|x m #Phoenix v|tome|x m #Microfocus CT #3D X-Ray Inspection #Industrial CT Scanner #3D CT Inspection #Semiconductor CT Inspection #PCBA X-Ray CT #Used GE v|tome|x m #Used Industrial CT
GE Phoenix Nanome|x Neo is a premium nanofocus X-Ray inspection system integrating 2D X-ray, Planar|CT and full 3D computed tomography in one platform, designed for non-destructive testing, failure analysis, R&D and quality control of advanced electronic assemblies, semiconductor packages, PCBs and lithium battery components.
The Nanome|x Neo adopts 180kV / 20W high-performance nanofocus X-ray tube with diamond target window, paired with high dynamic cooled DXR flat panel detector. It delivers ultra-fine feature recognition and high magnification imaging to visualize hidden internal structures and micro-defects that cannot be captured by conventional optical inspection.
#GEPhoenix #NanomexNeo #XrayInspection #NanoCT #SemiconductorTesting #PCBA #BGAVoid #FailureAnalysis #SMTInspectionWorld
GE phoenix|x-ray nanome|x is an ultra-high-resolution nanofocus X-Ray inspection system designed for advanced inspection of semiconductor packages, SMT assemblies, microelectronics and high-density electronic components.
Using high-power nanofocus X-Ray technology, the nanome|x provides detailed imaging of extremely small internal structures and hidden defects that are difficult or impossible to detect using conventional optical inspection. It is particularly suitable for BGA, CSP, Flip Chip, semiconductor packages, die attach and advanced electronic assemblies.
#GE phoenix nanome|x #GE Nanome|x #Phoenix Nanome|x X-Ray #Nanofocus X-Ray Inspection #Ultra High Resolution X-Ray #Semiconductor X-Ray Inspection #SMT X-Ray Inspection #BGA X-Ray Inspection #Flip Chip Inspection #3D nanoCT #Used GE Nanome|x
GE phoenix|x-ray nanome|x is a high-resolution nanofocus X-Ray inspection system designed for advanced inspection of SMT assemblies, semiconductor packages, microelectronic components and high-density PCBs.
With advanced nanofocus X-Ray technology, the nanome|x provides extremely high-resolution imaging for detecting hidden defects and analyzing complex internal structures that cannot be identified by conventional optical inspection. Historical GE specifications indicate detail detectability down to approximately 0.2 µm, depending on system configuration.
#GE phoenix nanome|x #GE Nanome|x #Phoenix Nanome|x X-Ray #Nanofocus X-Ray Inspection #Nano X-Ray Inspection #Semiconductor X-Ray Inspection #SMT X-Ray Inspection #BGA X-Ray Inspection #3D nanoCT #Used GE Nanome|x #Used X-Ray Inspection Equipment
Nordson DAGE XD7600NT is a high-resolution X-Ray inspection system designed for detailed inspection and failure analysis of electronic assemblies, PCBs, semiconductor packages and advanced electronic components.
The XD7600NT combines a high-performance sealed transmissive X-Ray tube, advanced digital imaging and high-magnification inspection capabilities to reveal hidden structures and internal defects that cannot be identified through conventional optical inspection.
#Nordson DAGE XD7600NT #DAGE XD7600NT #XD7600NT X-Ray #Nordson DAGE X-Ray #High Resolution X-Ray Inspection #BGA X-Ray Inspection #BGA Void Inspection #Semiconductor X-Ray Inspection #Used XD7600NT #Used X-Ray Inspection Equipment
Nordson DAGE Quadra 5 is a high-performance X-Ray inspection system designed for SMT, PCBA and semiconductor package inspection.
The Quadra 5 combines high-resolution X-Ray imaging with advanced inspection capabilities to visualize hidden structures and internal defects that cannot be identified through conventional optical inspection. It supports 2D and 3D X-Ray inspection, making it suitable for detailed analysis of electronic assemblies and advanced packages.
#Nordson DAGE Quadra 5 #Quadra 5 X-Ray #Nordson DAGE X-Ray #Quadra 5 X-Ray Inspection #SMT X-Ray Inspection #PCBA X-Ray Inspection #BGA X-Ray Inspection #3D X-Ray Inspection #Used Quadra 5 #Used X-Ray Inspection Equipment
Nordson DAGE XD7800 is equipped with world-class ultra-fine micro-focus X-ray source and high-sensitivity Flat Panel Detector, achieving outstanding magnification and sharp imaging for micro solder bump inspection.
Powerful analysis software supports automatic void calculation, precise dimensional measurement and defect reporting. The stable multi-axis motorized stage enables flexible sample positioning for small advanced packaging samples.
It is the upgraded model of XD7500NT, favored for semiconductor packaging and high-end failure analysis work.
#NordsonDAGEXD7800 #DAGEXRayInspection #SMTXRayInspection #PCBAXRayInspection #BGAXRayInspection #UsedDAGEXD7800 #MicroFocusXRay #3DCTXray
German VISCOM offline micro-focus X-ray inspection system for SMT manufacturing. Optimized for void & solder joint inspection of BGA, QFN, power semiconductors and complex PCBA. Optional 3D CT function available.
#VISCOM X7056RS #VISCOM X-Ray Inspection #VISCOM 3D AXI #X7056RS AXI #SMT X-Ray Inspection #PCBA X-Ray Inspection #BGA X-Ray Inspection #3D AXI Inspection #Used VISCOM X7056RS #Used X-Ray Inspection Equipment
Premium ultra-high resolution micro-focus X-ray system for semiconductor packaging and SMT failure analysis. Ideal for BGA, CSP, Flip Chip and PCBA solder joint & void inspection.
#DAGE XD7500NT #DAGE X-Ray Inspection #XD7500NT X-Ray #DAGE SMT X-Ray #SMT X-Ray Inspection #PCBA X-Ray Inspection #BGA X-Ray Inspection #QFN X-Ray Inspection #Used DAGE XD7500NT #Used X-Ray Inspection Equipment
German high-performance micro-focus X-ray machine dedicated for SMT production lines. Optimized for BGA, QFN, CSP solder joint & void inspection on PCBA mass production.
#YXLON Y.Cougar SMT #YXLON X-Ray #Y.Cougar SMT X-Ray #Microfocus X-Ray Inspection #SMT X-Ray Inspection #PCBA X-Ray Inspection #BGA X-Ray Inspection #Used YXLON Y.Cougar SMT #Used X-Ray Inspection Equipment #SMT Inspection Equipment
German high-performance micro-focus X-ray system with optional 3D CT capability. For BGA, WLCSP, semiconductor packaging and PCBA failure analysis & non-destructive inspection.
#YXLON #XrayInspection #IndustrialCT #SemiconductorTesting #FailureAnalysis #SMTInspection
High-precision industrial computed tomography system for 3D non-destructive metrology & defect analysis. Captures full volumetric internal data for electronics, additive manufacturing and precision molded components.
#IndustrialCT #3DXray #NonDestructiveTesting #Metrology #SemiconductorInspection
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