Brand: China & Asian X-Ray
Product DetailsFAQInquire
UNICOMP AX9100 Micro-focus X-Ray
UNICOMP AX9100 is an advanced micro-focus X-ray non-destructive testing system for high-density electronic packaging.
Equipped with 130kV micro-focus X-ray source and FPD flat panel detector, it supports 55° tilted 2.5D imaging and 7-axis motion control to achieve all-round inspection.
Perfect for detecting hidden defects like voids, poor soldering, delamination and displacement inside BGA, CSP, Flip Chip, LED, semiconductor packages and lithium batteries.
- 7-axis linkage & 360° rotary worktable
- 55° oblique 2.5D imaging for solder joint height measurement
- Max 1600X magnification for micro defect observation
- AI image enhancement for clearer defect recognition
- CNC automatic positioning & programmable inspection
- Built-in SPC quality statistical analysis
- CE certified, full radiation safety shielding
Specializing in brand new & used PARMI 3D Automatic Optical Inspection (AOI) and 3D Solder Paste Inspection (SPI) equipment sales, rental and genuine spare parts supply. With more than ten years of in-depth industry experience, we have served over 50 manufacturing enterprises at home and overseas.
All new and used devices are fully overhauled, precision-calibrated and functionally tested in strict accordance with original factory delivery standards. Every hardware component, software program and optical system is debugged item by item to ensure excellent operating stability and inspection accuracy. All equipment is fully production-ready and can be put into SMT line operation immediately after arrival.