Brand: PARMI 3D SPI
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PARMI HS70L 3D SPI
The PARMI HS70L is a high-performance 3D Solder Paste Inspection (SPI) system designed for modern SMT production lines.
Using advanced 3D optical inspection technology, the HS70D provides comprehensive three-dimensional analysis of solder paste printing quality, including solder paste height, volume, area, position, shape, and printing consistency.
By detecting printing defects at an early stage of the SMT process, the HS70D helps manufacturers reduce downstream defects, improve process stability, and increase overall PCBA production yield.
Solder Paste Height、Solder Paste Volume、Solder Paste Area、Solder Paste Offset、Insufficient Solder Paste、Excessive Solder Paste、Solder Paste Bridging、Printing Shape Abnormalities、Solder Paste Collapse、Printing Consistency
The HS70L uses 3D measurement technology to capture detailed three-dimensional data of solder paste deposits.
Compared with conventional 2D inspection, 3D SPI provides more comprehensive information about solder paste height, volume, and shape, enabling engineers to better evaluate printing quality and optimize SMT process parameters.
The PARMI HS70L can be integrated into automated SMT production lines and used together with solder paste printers, pick-and-place machines, reflow ovens, and AOI systems.
Inspecting solder paste immediately after printing allows manufacturers to identify potential defects before they move to subsequent production processes.
Solder paste printing quality has a direct impact on component placement and soldering performance.
3D SPI helps establish effective solder paste process control and reduce the risk of:
Printing Defects → Placement Issues → Soldering Defects → PCBA Rework
Early defect detection helps manufacturers improve production efficiency, reduce manufacturing costs, and achieve more consistent product quality.
AI Servers & Data Centers、Semiconductor Electronics、Automotive Electronics、EV & BMS、High-Speed Optical Modules、Telecommunications Equipment、Consumer Electronics、Industrial Electronics、Medical Electronics、High-Reliability PCBA
3D SPI focuses on solder paste printing quality, while 3D AOI focuses on component placement and PCB assembly defects after soldering.
Combining SPI and AOI creates a comprehensive SMT inspection process:
Solder Paste Printing → 3D SPI → Component Placement → Reflow Soldering → 3D AOI
This integrated inspection approach provides better process visibility and supports continuous improvement of SMT manufacturing quality.
3D SPI、3D AOI、X-Ray / AXI、ICT / FCT、Used SMT Inspection Equipment、SMT Inspection Equipment Rental、Spare Parts Supply、Equipment Upgrade & Maintenance、Technical Support
SMT Inspection World provides professional SMT inspection and testing equipment solutions for global electronics manufacturers, including equipment sales, used equipment trading, rental services, spare parts supply, equipment upgrades, maintenance, and technical support.
High-Speed 3D Solder Paste Inspection for High-Precision SMT Manufacturing.
Specializing in brand new & used PARMI 3D Automatic Optical Inspection (AOI) and 3D Solder Paste Inspection (SPI) equipment sales, rental and genuine spare parts supply. With more than ten years of in-depth industry experience, we have served over 50 manufacturing enterprises at home and overseas.
All new and used devices are fully overhauled, precision-calibrated and functionally tested in strict accordance with original factory delivery standards. Every hardware component, software program and optical system is debugged item by item to ensure excellent operating stability and inspection accuracy. All equipment is fully production-ready and can be put into SMT line operation immediately after arrival.
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